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Cure Equipment - List of Manufacturers, Suppliers, Companies and Products

Cure Equipment Product List

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Polyimide cure device (300mm wafer compatible clean bake device)

Polyimide cure device (300mm wafer compatible clean bake device)

300mm wafer-compatible polyimide cure, baking, low-temperature annealing, compatible with multilayer substrates. Thermal processing equipment for mass production of advanced electronic devices.

High uniformity hot air heating in a low oxygen atmosphere (N2) after vacuum replacement. Heating treatment of 300mm wafers in cassette units. Compatible with system LSI polyimide curing and flexible printed circuit board curing/annealing. Achieving both high quality and mass production with curing of 300mm wafer cassette units.

  • Annealing furnace

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Cure device

Cure device

Cure device

The cure device is a clean cure apparatus that overheats the lead frame after die bonding from both the top and bottom while purging with N2 hot gas simultaneously. This equipment automatically performs a series of operations from directly receiving the lead frame from the die bonder to feeding it into the cure furnace, storing it in a magazine, and discharging the magazine.

  • Other semiconductor manufacturing equipment

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Inline cure device 'SC3305'

Inline cure device 'SC3305'

Supports various temperature profiles! Airflow control suppresses oxidation and contamination of the workpiece.

The SC3305 is an inline curing device that automatically receives substrates directly from the previous equipment and stores them in the post-cure magazine. It comes standard with an automatic switching function for eight types. It maintains the temperature distribution within ±5°C during three-point measurement on a single substrate. The magazine unloader secures an effective space of 306mm for both empty magazine stock and full magazine stock (standard specification). 【Features】 ■ Automatic switching function for eight types ■ Airflow control to suppress oxidation and contamination of the workpiece ■ Supports various temperature profiles (8-zone individual temperature control system) ■ Flexible interface with various types of die bonders (optional) *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductor manufacturing equipment

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UV irradiation device Unicure system

UV irradiation device Unicure system

Powerful ultraviolet light generation technology and the unique cure system utilizing phototypesetting technology.

The technology of powerful ultraviolet light generation devices and the unique curing system that applies photo-plate making technology are active in the printing field, such as seal and label printing and business form printing, as well as being used in various areas including the bonding of printed circuit boards and electronic components, and the drying of surface protection films.

  • Marking machine
  • Lamps and light emitting devices

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